錦屏

Micro SIM Card Connector Push Pull Hinge Type

Material

Housing  : Hi-Tenp.Plastic (UL 94V-0)
Shell        : SUS, Cu Under plated Over all  nickel plated
Terminal : Copper Alloy, Nickel plated under over all gold plated on contact over all
                  Matte Tin plated on solder area

Specifcation

Current Rating : 0.5 AMP Max.
Dielectric Withsanding : 500V AC for one minute
Contact Resistance : 50m Ohms Max.
Insulation Resistance : 1000M Ohms Min at DC 500V
Operation Temperature : -40°C
+85°C